Hipak: -High Power,industry standard package -Designed for high reliability -Aluminium Silicon Carbide base plate for high power cycling -Aluminium Nitride substrates for low thermal resistance -Designed for very high SOA (Safe operating Area) -Low conduction and switching losses -Smooth switching characteristics for good EMC SPT (Soft Punch Through) Chips: -Designed for very high SOA (Safe Operating Area) - Low conduction and switching losses - Smooth switching characteristics for good EMC HIPAK: -高功率工業(yè)標準組裝 -可靠性高 -底座為適用于高功率運轉的鋁硅碳化物 -為極高SOA設計（安全工作區(qū)) -低導通及開關損耗 -對EMC開關性能良好高功率工業(yè)標準組裝 SPT 芯片 Soft Punch Through 軟穿通: - 為極高 SOA 設計(Safe Operating Area 安全工作區(qū)) - 低傳導及開關損耗 - 對EMC開關性能良好